Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below:
Small-outline transistor - Wikipedia
Size comparison of transistor packages. Two surface-mount packages, SOT23 and SOT223, are shown next to through-hole packages. A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [1]
SOT23-6 Datasheet, PDF - Alldatasheet
Description: Thermal Resistance and Derating Information. 6 Results. Datasheet: 123Kb/1P. Manufacturer: Global Mixed-mode Technology Inc.
The REF32xx is a very low drift, micropower, low-dropout, precision voltage reference family available in the tiny SOT23-6 package. The small size and low power consumption (120 μA max) of the REF32xx make it ideal for portable and battery-powered applications. This reference is stable with most capacitive loads.
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SOT23-6 - Bourns
SOT23-6 NOVEMBER 2015 Package Outline Dimensions This surface mount package consists of a chip mounted on a leadframe and fully encapsulated in an epoxy mold compound. With Pb-Free terminations, this package meets the requirements of IPC/Jedec J-STD-20, moisture level 1 at 260 °C. 645 132 MILLIMETERS (INCHES) DIMENSIONS = 1.70 - 2.10 (0.067 ...
SOT-23-6 Voltage Regulators - DC DC Switching Regulators
Products in the DC-DC switching regulator PMIC (Power Management Integrated Circuit) family are component-level devices used in applications requiring stabilization of a DC input voltage and/or transformation thereof to an output voltage of different magnitude.
Normalized Maximum Transient Thermal Impedance. 0.950 TYP.
SOT-23-6 Switching Voltage Regulators – Mouser - Mouser …
Mouser offers inventory, pricing, & datasheets for SOT-23-6 Switching Voltage Regulators.
SOT23 (Standard) Package Information Rev. 2020-09-08 1 of 6 September 2020 www.diodes.com © Diodes Incorporated SOT23 (Type S) PACKAGE INFORMATION Mechanical Data Surface Mount Package Weight: 0.009 grams (Approximate) Case Material: Molded Plastic UL Flammability Classification Rating 94V-0
Thermal design is very important for small outline transistor (SOT) packages. This paper compares the thermal performance of flip-chip on lead (FCOL) SOT23 packages with conventional wire-bond SOT23 packages. The results show that FCOL packages have better thermal-dissipation capabilities.